Art
J-GLOBAL ID：200902173405745767   Reference number：93A0692055

The Effect of Reflow Process Variables on the Wettability of Lead-Free Solders.

無鉛はんだの濡れ性に及ぼすリフロプロセス変数の影響
Author (1)：
MELTON C

About MELTON C

(Motorola, Illinois)

About Motorola, Illinois


Material：
JOM

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Volume： 45  Issue： 7  Page： 33-35  Publication year： Jul. 1993 
JST Material Number： C0321A  ISSN： 1047-4838  Document type： Article
Article type： 短報  Country of issue： United States (USA)  Language： ENGLISH (EN)
Thesaurus term：
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Keywords indexed to the article.
All keywords is available on JDreamIII(charged).
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reflow soldering

About reflow soldering

,...
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JST classification (1)：
JST classification
Category name(code) classified by JST.
Brazing 
(WC07050C)

About Brazing

Terms in the title (4)：
Terms in the title
Keywords automatically extracted from the title.
無鉛はんだ

About 無鉛はんだ

, 
濡れ性

About 濡れ性

, 
リフロ

About リフロ

, 
プロセス変数

About プロセス変数


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