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J-GLOBAL ID：200902173598258566   Reference number：93A0252233

An Assessment of the Use of Lead in Electronics Assembly. Part 1.

電子回路組立てでの鉛の使用の査定 1
Material：
Circuit World

About Circuit World


Volume： 19  Issue： 2  Page： 18-24  Publication year： Jan. 1993 
JST Material Number： H0927A  ISSN： 0305-6120  Document type： Article
Article type： 原著論文  Country of issue： United Kingdom (GBR)  Language： ENGLISH (EN)
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lead base alloy

About lead base alloy

,...
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JST classification (1)：
JST classification
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Solic-state devices in general 
(NC03010Z)

About Solic-state devices in general

Terms in the title (4)：
Terms in the title
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電子回路

About 電子回路

, 
組立て

About 組立て

, 
鉛

About 鉛

, 
査定

About 査定


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