Art
J-GLOBAL ID：200902174234333585
Reference number：02A0305487
Stress relaxation of wood during the elevating and lowering processes of temperature and the set after relaxation.
昇温及び降温過程における木材の応力緩和および緩和後のセット
Author (3)：
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Material：
Volume：
48
Issue：
1
Page：
8-13
Publication year：
Feb. 25, 2002
JST Material Number：
L3386A
ISSN：
1435-0211
Document type：
Article
Article type：
原著論文
Country of issue：
Germany, Federal Republic of (DEU)
Language：
ENGLISH (EN)
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Semi thesaurus term：
Thesaurus term/Semi thesaurus term
Keywords indexed to the article.
All keywords is available on JDreamIII(charged).
On J-GLOBAL, this item will be available after more than half a year after the record posted. In addtion, medical articles require to login to MyJ-GLOBAL.
JST classification (1)：
JST classification
Category name(code) classified by JST.
Nature and structure of wood(=timber)
Reference (15)：
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ARMSTRONG, LD. Effect of moisture changes on creep in wood. Nature. 1961, 191, 869-870
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GIBSON, EJ. Creep of wood: role of water and effect of changing moisture content. Nature. 1965, 206, 213-215
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HEARMAN, RFS. Moisture content changes and creep of wood. For Prod J. 1964, 14, 357-359
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HISADA, T. Creep and set behavior of wood relating to kiln drying. II. Effects of stress level on tensile creep of wood during drying. Mokuzai Gakkaishi. 1979, 25, 697-706
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MUKUDAI, J. Modeling and simulation of viscoelastic behavior (tensile strain) of wood under moisture content. Wood Sci Technol. 1986, 21, 49-63
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Terms in the title (6)：
Terms in the title
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