Art
J-GLOBAL ID：200902174428018885   Reference number：02A0140304

A Methodology for Fatigue Prediction of Electronic Components Under Random Vibration Load.

ランダムな振動負荷における電子部品の疲れ予測方法
Author (1)：
LI R S

About LI R S

(Motorola Inc., IL)

About Motorola Inc., IL


Material：
Journal of Electronic Packaging  (Transactions of the ASME. Journal of Electronic Packaging)

About Journal of Electronic Packaging


Volume： 123  Issue： 4  Page： 394-400  Publication year： Dec. 2001 
JST Material Number： T0929A  ISSN： 1043-7398  CODEN： JEPAE4  Document type： Article
Article type： 原著論文  Country of issue： United States (USA)  Language： ENGLISH (EN)
Thesaurus term：
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*mechanical vibration

About mechanical vibration

,...
Semi thesaurus term：
Thesaurus term/Semi thesaurus term
Keywords indexed to the article.
All keywords is available on JDreamIII(charged).
On J-GLOBAL, this item will be available after more than half a year after the record posted. In addtion, medical articles require to login to MyJ-GLOBAL.
thermal fatigue

About thermal fatigue

,...
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JST classification (2)：
JST classification
Category name(code) classified by JST.
Electric equipment 
(QG03070C)

About Electric equipment

,  Measurement,testing and reliability of solid-state devices 
(NC03040G)

About Measurement,testing and reliability of solid-state devices

Terms in the title (3)：
Terms in the title
Keywords automatically extracted from the title.
電子部品

About 電子部品

, 
疲れ

About 疲れ

, 
予測方法

About 予測方法


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