Art
J-GLOBAL ID：200902175317874835   Reference number：00A0953052

Rationale and Challenges for Optical Interconnects to Electronic Chips.

エレクトロニックチップの光相互接続のための原理と挑戦
Author (1)：
MILLER D A B

About MILLER D A B

(Stanford Univ., CA, USA)

About Stanford Univ., CA, USA


Material：
Proceedings of the IEEE  (Proc IEEE)

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Volume： 88  Issue： 6  Page： 728-749  Publication year： Jun. 2000 
JST Material Number： D0378A  ISSN： 0018-9219  CODEN： IEEPAD  Document type： Article
Article type： 文献レビュー  Country of issue： United States (USA)  Language： ENGLISH (EN)
Thesaurus term：
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*semiconductor chip

About semiconductor chip

,...
Semi thesaurus term：
Thesaurus term/Semi thesaurus term
Keywords indexed to the article.
All keywords is available on JDreamIII(charged).
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optical modulator

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,...
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JST classification (2)：
JST classification
Category name(code) classified by JST.
Manufacturing technology of solid-state devices 
(NC03030V)

About Manufacturing technology of solid-state devices

,  Semiconductor integrated circuit 
(NC03162T)

About Semiconductor integrated circuit

Terms in the title (2)：
Terms in the title
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光相互接続

About 光相互接続

, 
原理

About 原理


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