Art
J-GLOBAL ID：200902177260213252   Reference number：97A0060261

Transient Liquid-Phase Bonding in the NiAl/Cu/Ni System-A Microstructural Investigation.

NiAl/Cu/Ni系における遷移液相接合 微細組織の研究
Author (2)：
GALE W F

About GALE W F

(Auburn Univ., AL)

About Auburn Univ., AL

, 
GUAN Y

About GUAN Y

(Auburn Univ., AL)

About Auburn Univ., AL


Material：
Metallurgical and Materials Transactions. A. Physical Metallurgy and Materials Science  (Metall Mater Trans A)

About Metallurgical and Materials Transactions. A. Physical Metallurgy and Materials Science


Volume： 27  Issue： 11  Page： 3621-3629  Publication year： Nov. 1996 
JST Material Number： E0265B  ISSN： 1073-5623  CODEN： MTTABN  Document type： Article
Article type： 原著論文  Country of issue： United States (USA)  Language： ENGLISH (EN)
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intermetallic compound

About intermetallic compound

,...
Semi thesaurus term：
Thesaurus term/Semi thesaurus term
Keywords indexed to the article.
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diffusion welding

About diffusion welding


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JST classification (1)：
JST classification
Category name(code) classified by JST.
Welding techniques 
(WC07030G)

About Welding techniques

Terms in the title (6)：
Terms in the title
Keywords automatically extracted from the title.
Cu

About Cu

, 
Ni

About Ni

, 
遷移

About 遷移

, 
液相

About 液相

, 
微細組織

About 微細組織

, 
研究

About 研究


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