Art
J-GLOBAL ID：200902178869262710
Reference number：94A0826326
Problems of Joints in Packaging of Electronic Devices.
特集: 界面力学 電子デバイス実装における接合の諸問題
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Author (1)：
Material：
Volume：
60
Issue：
577
Page：
1905-1912
Publication year：
Sep. 1994
JST Material Number：
F0227B
ISSN：
0387-5008
Document type：
Article
Article type：
解説
Country of issue：
Japan (JPN)
Language：
JAPANESE (JA)
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JST classification (1)：
JST classification
Category name(code) classified by JST.
Materials of solid-state devices
Reference (28)：
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(1) Bogy,D.B.,Trans.ASME,J.Appl.Mech.,42(1975),93.
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(2) 白鳥,日本機械学会講習会教材,No.900-83(1990),9.
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(3) Chen,D.H.and Nishitani,H.,Advances in Electronic Packaging,(1992),529,ASME.
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(4) 陳•西谷,日本機械学会第70期通常総会講演論文集,No. 930-9,I(1993-4),472.
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(5) 服部•ほか3名,機論,54-499,A(1988),499.
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