Study on Diffusion Bonding of Copper (Report 1). Dffusion Bonding of Copper Machined Ultra Finely.

FUKAYA YASUHIRO; HIGASHI YASUO; HIGO TOSHIYASU; HAMAOKA MASAYOSHI; SUEDA MINORU; KOBAYASHI TOSHIRO; OGAWA MAKOTO; SHINOZAKI KENJI

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J-GLOBAL ID：200902196064976927 Reference number：97A0897965

Study on Diffusion Bonding of Copper (Report 1). Dffusion Bonding of Copper Machined Ultra Finely.

銅の拡散接合に関する研究(第1報) 超精密加工された銅板の拡散接合

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Material：
Volume： 15 Issue： 3 Page： 467-475 Publication year： Aug. 1997
JST Material Number： Y0413A ISSN： 0288-4771 Document type： Article
Article type：原著論文 Country of issue： Japan (JPN) Language： JAPANESE (JA)

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Welding conditions , Particle accelerators in general and theory

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