Art
J-GLOBAL ID：200902198504536838
Reference number：96A0862136
Numerical Stress Analysis of Resin Cracking in LSI Plastic Packages Under Temperature Cyclic Loading.
温度サイクル負荷のもとでのLSIプラスチックパッケージにおける樹脂割れの数値応力解析
Author (1)：
Material：
Volume：
19
Issue：
3
Page：
593-600
Publication year：
Aug. 1996
JST Material Number：
W0590A
ISSN：
1070-9894
Document type：
Article
Article type：
原著論文
Country of issue：
United States (USA)
Language：
ENGLISH (EN)
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JST classification (1)：
JST classification
Category name(code) classified by JST.
Materials of solid-state devices
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