Investigations of all lead free IGBT module structure with low thermal resistance and high reliability

NISHIMURA Y.; MOROZUMI A.; MOCHIZUKI E.; TAKAHASHI Y.

Art

J-GLOBAL ID：200902202195803122 Reference number：07A0739486

Investigations of all lead free IGBT module structure with low thermal resistance and high reliability

低熱抵抗と高信頼性を持つ完全鉛フリーIGBTモジュール構造の検討

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Author (4)： , , ,
Material：
Volume： 18th Page： 249-252 Publication year： 2006
JST Material Number： W1300A ISSN： 1943-653X Document type： Proceedings
Article type：原著論文 Country of issue： United States (USA) Language： ENGLISH (EN)

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Transistors , Connecting parts , Thermal conduction

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