Effects of processing method and additive composition on microstructure and thermal conductivity of Si<sub>3</sub>N<sub>4</sub> ceramics

ZHU Xinwen; ZHOU You; HIRAO Kiyoshi

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J-GLOBAL ID：200902203083479965 Reference number：06A0014341

Effects of processing method and additive composition on microstructure and thermal conductivity of Si₃N₄ ceramics

Si₃N₄セラミックスの微構造と熱伝導率に対するプロセシング方法と添加剤組成の効果

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Volume： 26 Issue： 4-5 Page： 711-718 Publication year： 2006
JST Material Number： E0801B ISSN： 0955-2219 Document type： Article
Article type：原著論文 Country of issue： United Kingdom (GBR) Language： ENGLISH (EN)

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Properties of ceramics and ceramic whiteware

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Effects of processing method and additive composition on microstructure and thermal conductivity of Si3N4 ceramics

Effects of processing method and additive composition on microstructure and thermal conductivity of Si₃N₄ ceramics