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J-GLOBAL ID:200902205097230156   Reference number:07A0187341

Self-Aligned Wafer-Level Integration Technology With High-Density Interconnects and Embedded Passives

高密度配線と埋め込み受動素子の自己整合ウエハレベル集積技術
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Volume: 30  Issue:Page: 11-18  Publication year: Feb. 2007 
JST Material Number: W0590A  ISSN: 1521-3323  CODEN: ITAPFZ  Document type: Article
Article type: 原著論文  Country of issue: United States (USA)  Language: ENGLISH (EN)
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Materials of solid-state devices  ,  Manufacturing technology of solid-state devices 
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