Interactions Between Brightener and Chloride Ions on Copper Electroplating for Laser-Drilled Via-Hole Filling

DOW W-P; HUANG H-S; LIN Z

Art

J-GLOBAL ID：200902210113296280 Reference number：03A0611394

Interactions Between Brightener and Chloride Ions on Copper Electroplating for Laser-Drilled Via-Hole Filling

レーザドリルバイアホール充填のための銅電気めっきにおける光沢剤と塩化物イオン間の相互作用

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Material：
Volume： 6 Issue： 9 Page： C134-C136 Publication year： Sep. 2003
JST Material Number： W1290A ISSN： 1099-0062 CODEN： ESLEF6 Document type： Article
Article type：短報 Country of issue： United States (USA) Language： ENGLISH (EN)

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Electroplating , Electrochemical reaction

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