Coupled Mesoscale-Continuum Simulations of Copper Electrodeposition in a Trench

DREWS T O; WEBB E G; MA D L; ALAMEDA J; BRAATZ R D; ALKIRE R C

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J-GLOBAL ID：200902211871235581 Reference number：04A0144812

Coupled Mesoscale-Continuum Simulations of Copper Electrodeposition in a Trench

溝中の銅電着のメソスケール-連続体連成シミュレーション

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Author (6)： , , , , ,
Material：
Volume： 50 Issue： 1 Page： 226-240 Publication year： Jan. 2004
JST Material Number： A0337A ISSN： 0001-1541 CODEN： AICEA Document type： Article
Article type：原著論文 Country of issue： United States (USA) Language： ENGLISH (EN)

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Electroplating , Analysis of chemical process

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