Art
J-GLOBAL ID:200902214901768554   Reference number:06A0261159

Development of Printed Circuit Board Multi-layered Type ECF-pump and Its Application to Liquid Cooling System

プリント基板多層形ECFポンプの開発と液冷システムへの応用
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Volume: 72  Issue: 715  Page: 991-996  Publication year: Mar. 25, 2006 
JST Material Number: F0045B  ISSN: 0387-5024  Document type: Article
Article type: 原著論文  Country of issue: Japan (JPN)  Language: JAPANESE (JA)
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Solic-state devices in general  ,  Magnetohydrodynamics 
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