Art
J-GLOBAL ID：200902233333966189   Reference number：03A0744377

Three-Dimensional Interconnect With Excellent Moisture Resistance for Low-Cost MMICs

低コストMMIC用のきわめて優れた耐湿性を備えた三次元配線
Author (3)：
SUGITANI S

About SUGITANI S

(NTT Corp., Kanagawa, JPN)

About NTT Corp., Kanagawa, JPN

, 
ISHII T

About ISHII T

(NTT Corp., Kanagawa, JPN)

About NTT Corp., Kanagawa, JPN

, 
TOKUMITSU M

About TOKUMITSU M

(NTT Corp., Kanagawa, JPN)

About NTT Corp., Kanagawa, JPN


Material：
IEEE Transactions on Advanced Packaging  (IEEE Trans Adv Packag)

About IEEE Transactions on Advanced Packaging


Volume： 26  Issue： 2  Page： 133-140  Publication year： May. 2003 
JST Material Number： W0590A  ISSN： 1521-3323  CODEN： ITAPFZ  Document type： Article
Article type： 原著論文  Country of issue： United States (USA)  Language： ENGLISH (EN)
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*multilayer interconnection

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,...
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BCB

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JST classification (1)：
JST classification
Category name(code) classified by JST.
Manufacturing technology of solid-state devices 
(NC03030V)

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Terms in the title (2)：
Terms in the title
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MMIC

About MMIC

, 
耐湿性

About 耐湿性


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