Art
J-GLOBAL ID：200902250178702317   Reference number：05A0262111

薄型化に対応する実装材料 COF技術動向から求められるFPCの課題

Author (1)：
IMAI HIDEO

About IMAI HIDEO

(セイコーエプソン 生産技術開発本部 先端技開セ)

About セイコーエプソン 生産技術開発本部 先端技開セ


Material：
エレクトロニクス実装学会誌  (Journal of Japan Institute of Electronics Packaging)

About エレクトロニクス実装学会誌


Volume： 8  Issue： 2  Page： 95-98  Publication year： Mar. 01, 2005 
JST Material Number： S0579C  ISSN： 1343-9677  Document type： Article
Article type： 解説  Country of issue： Japan (JPN)  Language： JAPANESE (JA)
Thesaurus term：
Thesaurus term/Semi thesaurus term
Keywords indexed to the article.
All keywords is available on JDreamIII(charged).
On J-GLOBAL, this item will be available after more than half a year after the record posted. In addtion, medical articles require to login to MyJ-GLOBAL.
*liquid crystal display

About liquid crystal display

,...
Semi thesaurus term：
Thesaurus term/Semi thesaurus term
Keywords indexed to the article.
All keywords is available on JDreamIII(charged).
On J-GLOBAL, this item will be available after more than half a year after the record posted. In addtion, medical articles require to login to MyJ-GLOBAL.
*flexible printed circuit

About flexible printed circuit

,...
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JST classification (2)：
JST classification
Category name(code) classified by JST.
Display equipment 
(NC06030Q)

About Display equipment

,  Printed circuits 
(NA05040O)

About Printed circuits

Terms in the title (5)：
Terms in the title
Keywords automatically extracted from the title.
薄型化

About 薄型化

, 
実装

About 実装

, 
COF

About COF

, 
技術動向

About 技術動向

, 
FPC

About FPC


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