A new method for deposition of cubic Ta diffusion barrier for Cu metallization

YUAN Z L; ZHANG D H; LI C Y; PRASAD K; TAN C M; TANG L J

Art

J-GLOBAL ID：200902251707308871 Reference number：03A0457492

A new method for deposition of cubic Ta diffusion barrier for Cu metallization

Cuメタライゼーション用の立方晶Ta拡散障壁の新しい堆積法

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Material：
Volume： 434 Issue： 1/2 Page： 126-129 Publication year： Jun. 23, 2003
JST Material Number： B0899A ISSN： 0040-6090 Document type： Article
Article type：短報 Country of issue： Netherlands (NLD) Language： ENGLISH (EN)

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Metallic thin films , Manufacturing technology of solid-state devices

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