A New Role of CFD Simulation in Thermal Design of Compact Electronic Equipment: Application of the Build-up Approach to Thermal Analysis of a Benchmark Model

NAKAYAMA W; MATSUKI R; HACHO Y; YAJIMA K

Art

J-GLOBAL ID：200902256312976915 Reference number：05A0204737

A New Role of CFD Simulation in Thermal Design of Compact Electronic Equipment: Application of the Build-up Approach to Thermal Analysis of a Benchmark Model

小型電子装置の熱設計におけるCFDシミュレーションの新しい役割:ベンチマークモデル熱解析へのビルドアップ法の適用

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Material：
Volume： 126 Issue： 4 Page： 440-448 Publication year： Dec. 2004
JST Material Number： T0929A ISSN： 1043-7398 CODEN： JEPAE4 Document type： Article
Article type：原著論文 Country of issue： United States (USA) Language： ENGLISH (EN)

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Solic-state devices in general , Heat transfer in general and fundamentals , CAD,CAM

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