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J-GLOBAL ID:200902256312976915   Reference number:05A0204737

A New Role of CFD Simulation in Thermal Design of Compact Electronic Equipment: Application of the Build-up Approach to Thermal Analysis of a Benchmark Model

小型電子装置の熱設計におけるCFDシミュレーションの新しい役割:ベンチマークモデル熱解析へのビルドアップ法の適用
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Volume: 126  Issue:Page: 440-448  Publication year: Dec. 2004 
JST Material Number: T0929A  ISSN: 1043-7398  CODEN: JEPAE4  Document type: Article
Article type: 原著論文  Country of issue: United States (USA)  Language: ENGLISH (EN)
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Solic-state devices in general  ,  Heat transfer in general and fundamentals  ,  CAD,CAM 

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