Art
J-GLOBAL ID:200902256555776256   Reference number:08A0405123

Effect of substrate temperature and roughness on the solidification of copper plasma sprayed droplets

銅の溶射溶滴の凝固に及ぼす基板温度と粗さの効果
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Material:
Volume: 485  Issue: 1-2  Page: 119-129  Publication year: Jun. 25, 2008 
JST Material Number: D0589B  ISSN: 0921-5093  Document type: Article
Article type: 原著論文  Country of issue: Netherlands (NLD)  Language: ENGLISH (EN)
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Thermal spraying 
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