高密度チップ間接続構造パッケージの開発

KURITA YOICHIRO; SOEJIMA KOJI; KIKUCHI KATSUMI; TAKAHASHI MASATAKE; TAGO MASAMOTO; KOIKE MASAHIRO; MORISHITA YOSHIAKI; YAMAMICHI SHINTARO; KAWANO MASAYA

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J-GLOBAL ID：200902257325401900 Reference number：06A0571442

高密度チップ間接続構造パッケージの開発

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Material：
Volume： 15th Page： 189-192 Publication year： Oct. 13, 2005
JST Material Number： X0060A ISSN： 2434-396X Document type： Proceedings
Article type：短報 Country of issue： Japan (JPN) Language： JAPANESE (JA)

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Printed circuits , Materials of solid-state devices

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