Simultaneous Formation of Multiwall Carbon Nanotubes and their End-Bonded Ohmic Contacts to Ti Electrodes for Future ULSI Interconnects

NIHEI M; HORIBE M; KAWABATA A; AWANO Y

Art

J-GLOBAL ID：200902258261481579 Reference number：04A0447889

Simultaneous Formation of Multiwall Carbon Nanotubes and their End-Bonded Ohmic Contacts to Ti Electrodes for Future ULSI Interconnects

将来の超LSI相互接続に対する,多層カーボンナノチューブならびに「Ti電極との端部結合Ohm接触」の同時形成

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Material：
Volume： 43 Issue： 4B Page： 1856-1859 Publication year： Apr. 30, 2004
JST Material Number： G0520B ISSN： 0021-4922 Document type： Article
Article type：原著論文 Country of issue： Japan (JPN) Language： ENGLISH (EN)

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Atomic and molecular clusters , Semiconductor-metal contacts

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