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J-GLOBAL ID:200902262025697800   Reference number:03A0456411

3GHz Through-Hole Signal Via Model Considering Power/Ground Plane Resonance Coupling and Via Neck Effect

電源/接地平面共振結合とバイアネック効果を考慮した3GHzスルーホール信号バイアモデル
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Volume: 53rd  Page: 1017-1022  Publication year: 2003 
JST Material Number: H0393A  ISSN: 0569-5503  Document type: Proceedings
Article type: 原著論文  Country of issue: United States (USA)  Language: ENGLISH (EN)
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Printed circuits  ,  Noise in general 
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