Copper Leaching Behavior from Waste Printed Circuit Board in Ammoniacal Alkaline Solution

KOYAMA Kazuya; TANAKA Mikiya; LEE Jae-chun

Art

J-GLOBAL ID：200902262096764797 Reference number：06A0558399

Copper Leaching Behavior from Waste Printed Circuit Board in Ammoniacal Alkaline Solution

アンモニアアルカリ溶液中での廃棄プリント回路基板からの銅浸出挙動

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Material：
Volume： 47 Issue： 7 Page： 1788-1792 Publication year： Jul. 20, 2006
JST Material Number： G0668A ISSN： 1345-9678 Document type： Article
Article type：原著論文 Country of issue： Japan (JPN) Language： ENGLISH (EN)

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Recycling of resources , Smelting

Reference (9)：

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2) S. Nigo, H. Majima, T. Hirato, Y. Awakura and M. Iwai: J. Min. Mater. Proc. Inst. Japan (Shigen-to-Sozai) 109 (1993) 337–340.
3) K. Zhou, K. Shinme and S. Anezaki: J. Min. Mater. Proc. Inst. Japan (Shigen-to-Sozai) 111 (1995) 49–53.
4) K. Zhou, K. Shinme and S. Anezaki: J. Min. Mater. Proc. Inst. Japan (Shigen-to-Sozai) 111 (1995) 55–58.
5) J. Sedzimir and M. Bujanska: Hydrometallurgy 3 (1978) 233–248.

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