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J-GLOBAL ID:200902262096764797   Reference number:06A0558399

Copper Leaching Behavior from Waste Printed Circuit Board in Ammoniacal Alkaline Solution

アンモニアアルカリ溶液中での廃棄プリント回路基板からの銅浸出挙動
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Volume: 47  Issue:Page: 1788-1792  Publication year: Jul. 20, 2006 
JST Material Number: G0668A  ISSN: 1345-9678  Document type: Article
Article type: 原著論文  Country of issue: Japan (JPN)  Language: ENGLISH (EN)
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Recycling of resources  ,  Smelting 
Reference (9):
  • 1) H. Majima, S. Nigo, T. Hirato, Y. Awakura and M. Iwai: J. Min. Mater. Proc. Inst. Japan (Shigen-to-Sozai) 109 (1993) 191–194.
  • 2) S. Nigo, H. Majima, T. Hirato, Y. Awakura and M. Iwai: J. Min. Mater. Proc. Inst. Japan (Shigen-to-Sozai) 109 (1993) 337–340.
  • 3) K. Zhou, K. Shinme and S. Anezaki: J. Min. Mater. Proc. Inst. Japan (Shigen-to-Sozai) 111 (1995) 49–53.
  • 4) K. Zhou, K. Shinme and S. Anezaki: J. Min. Mater. Proc. Inst. Japan (Shigen-to-Sozai) 111 (1995) 55–58.
  • 5) J. Sedzimir and M. Bujanska: Hydrometallurgy 3 (1978) 233–248.
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