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J-GLOBAL ID：200902265379596733   Reference number：07A1213079

The Redistributed Chip Package: A Breakthrough for Advanced Packaging

再配分チップパッケージ:先進パッケージへのブレークスルー
Author (9)：
KESER Beth

About KESER Beth

(Freescale Semiconductor, Arizona)

About Freescale Semiconductor, Arizona

, 
AMRINE Craig

About AMRINE Craig

(Freescale Semiconductor, Arizona)

About Freescale Semiconductor, Arizona

, 
DUONG Trung

About DUONG Trung

(Freescale Semiconductor, Arizona)

About Freescale Semiconductor, Arizona

, 
FAY Owen

About FAY Owen

(Freescale Semiconductor, Arizona)

About Freescale Semiconductor, Arizona

, 
HAYES Scott

About HAYES Scott

(Freescale Semiconductor, Arizona)

About Freescale Semiconductor, Arizona

, 
LEAL George

About LEAL George

(Freescale Semiconductor, Arizona)

About Freescale Semiconductor, Arizona

, 
LYTLE William

About LYTLE William

(Freescale Semiconductor, Arizona)

About Freescale Semiconductor, Arizona

, 
MITCHELL Doug

About MITCHELL Doug

(Freescale Semiconductor, Arizona)

About Freescale Semiconductor, Arizona

, 
WENZEL Robert

About WENZEL Robert

(Freescale Semiconductor, Arizona)

About Freescale Semiconductor, Arizona


Material：
Proceedings. Electronic Components & Technology Conference  (IEEE Electronic Components and Technology Conference)

About Proceedings. Electronic Components & Technology Conference


Volume： 57th Vol.1  Page： 286-291  Publication year： 2007 
JST Material Number： H0393A  ISSN： 0569-5503  Document type： Proceedings
Article type： 原著論文  Country of issue： United States (USA)  Language： ENGLISH (EN)
Thesaurus term：
Thesaurus term/Semi thesaurus term
Keywords indexed to the article.
All keywords is available on JDreamIII(charged).
On J-GLOBAL, this item will be available after more than half a year after the record posted. In addtion, medical articles require to login to MyJ-GLOBAL.
*IC package

About IC package

, 
*interposition

About interposition

, 
solder

About solder

, 
MEMS

About MEMS

, 
reliability test

About reliability test

, 
heat cycle

About heat cycle

, 
*semiconductor chip

About semiconductor chip

, 
cutting (machining)

About cutting (machining)

, 
SiP

About SiP


Semi thesaurus term：
Thesaurus term/Semi thesaurus term
Keywords indexed to the article.
All keywords is available on JDreamIII(charged).
On J-GLOBAL, this item will be available after more than half a year after the record posted. In addtion, medical articles require to login to MyJ-GLOBAL.
BGA

About BGA

, 
dicing

About dicing

, 
Pb free solder

About Pb free solder


JST classification (1)：
JST classification
Category name(code) classified by JST.
Materials of solid-state devices 
(NC03020K)

About Materials of solid-state devices

Terms in the title (3)：
Terms in the title
Keywords automatically extracted from the title.
再配分

About 再配分

, 
パッケージ

About パッケージ

, 
ブレークスルー

About ブレークスルー


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