Experimental analysis of thermal displacement and strain distributions in a small outline J-leaded electronic package by using wedged-glass phase-shifting moire interferometry

MORITA Yasuyuki; ARAKAWA Kazuo; TODO Mitsugu

Art

J-GLOBAL ID：200902276790624430 Reference number：07A1047586

Experimental analysis of thermal displacement and strain distributions in a small outline J-leaded electronic package by using wedged-glass phase-shifting moire interferometry

楔形ガラス位相シフトモアレ干渉測定を利用した小型J字形リード電子パッケージ内の熱変位と歪分布の実験による解析

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Author (3)： , ,
Material：
Volume： 46 Issue： 1 Page： 18-26 Publication year： Jan. 2008
JST Material Number： A0602B ISSN： 0143-8166 Document type： Article
Article type：原著論文 Country of issue： United Kingdom (GBR) Language： ENGLISH (EN)

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Measurement,testing and reliability of solid-state devices , Interferometry and interferometers , Materials of solid-state devices

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