Three-Dimensional System-in-Package Using Stacked Silicon Platform Technology

KRIPESH Vaidyanathan; YOON Seung Wook; GANESH V. P.; KHAN Navas; ROTARU Mihai D.; FANG Wang; IYER Mahadevan K.

Art

J-GLOBAL ID：200902285572162229 Reference number：05A0744326

Three-Dimensional System-in-Package Using Stacked Silicon Platform Technology

積層シリコンプラットフォーム技術を用いた三次元システムインパッケージ

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Material：
Volume： 28 Issue： 3 Page： 377-386 Publication year： Aug. 2005
JST Material Number： W0590A ISSN： 1521-3323 CODEN： ITAPFZ Document type： Article
Article type：原著論文 Country of issue： United States (USA) Language： ENGLISH (EN)

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Hydrid integrated circuit , Printed circuits

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