Pat
J-GLOBAL ID:200903000104203219
アンダーフィル用接着フィルム及びこれを用いた半導体装置
Inventor:
,
,
,
Applicant, Patent owner:
Agent (1):
森岡 博
Gazette classification:公開公報
Application number (International application number):2001277591
Publication number (International publication number):2003082298
Application date: Sep. 13, 2001
Publication date: Mar. 19, 2003
Summary:
【要約】【課題】 半導体素子と配線回路基板および接続用電極部に生ずる応力の緩和効果に優れ、かつ半導体素子と配線回路基板との電気的接続信頼性に優れたアンダーフィル用接着フィルムを提供する。【解決手段】 ポリカルボジイミドからなるアンダーフィル用接着フィルム。
Claim (excerpt):
ポリカルボジイミドからなるアンダーフィル用接着フィルム。
IPC (6):
C09J 7/00
, C08G 18/02
, C08G 73/00
, C09J179/00
, C09K 3/10
, H01L 21/56
FI (6):
C09J 7/00
, C08G 18/02
, C08G 73/00
, C09J179/00
, C09K 3/10 Z
, H01L 21/56 E
F-Term (91):
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