J-GLOBAL ID:200904005250378514  Research Project code:9950000253 Update date:Dec. 11, 2001

Development of heat-resistant composit materials

Study period:1997 - 1999
Research overview:
The application temperature limit of organic polymer materials is around 500 °C. That of silicon materials is higher than 1,000 °C, but they are brittle. Fiber-reinforced composite materials consisting of phenol resin have been used for rocket nozzles, and the ablator of recoverable capsules, but the performance of these materials is not satisfactory. To take advantage in heat resistance and light-weight of organic polymer materials containing silicon, we develops new heat-resistant materials excellent in filming characteristic by combining heat-resistant polymer high in toughness, such as polyimide.
Keywords (5):
有機 ,  無機 ,  材料 ,  耐熱性 ,  複合
Research program: -
Ministry with control over the research :
Ministry of Education, Culture, Sports, Science and Technology

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