Proj
J-GLOBAL ID:200904016024161369  Research Project code:0150002891 Update date:Jun. 13, 2008

The development of the next generation type high thermal conductive substrate

次世代型高熱伝導基板の開発
Study period:2000 - 2000
Organization (1):
Investigating Researcher (1):
Research field (1): Other
Research overview:
The latest electronic circuit is requested to have high function, high density, and high output, which are not requested in the past with the advent of an advanced information society. To meet this, the enhancement of the radiation characteristics of a circuit substrate is an indispensable issue. The present research develops a high thermal conductive substrate by forming a ceramic thin film on a novel material substrate having lightweight and high strength. The product is expected to evolve application in various fields, including a radiation substrate for an information communication device, and related parts for an electric car or the like expected rapid demand expansion in future.
Keywords (5):
high thermal conduction ,  thermal conduction ,  substrate ,  ceramics ,  thin film
Research program: -

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