Proj
J-GLOBAL ID:200904033841096562  Research Project code:9800021743 Update date:Dec. 15, 2003

Study of codeposition mechanism of composite coating

複合めっきにおける粒子共析に関する研究
Study period:1992 - 1995
Organization (1):
Investigating Researcher (3):
Research overview:
Codeposition mechanism of particles for preparation of electroless composite plating is studied. Codeposition mechanism of particle in composite plating is studied and a method to disperse and codeposite particles uniformly in the plating film is researched.
Keywords (6):
composite ,  electroless ,  plating ,  film(cover) ,  particle ,  dispersion
Research program: Ordinary Research
Research budget: 1993: \100,000

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