Research Project code：9800036996
Update date：Jan. 24, 2003
Roughness of the ground silicon wafers and the damage region near the surface
1995 - 2000
Investigating Researcher (1)：
The total thickness variation value (TTV) of the silicon wafers play a important roll in the fabrication of large scale integrated circuits (LSI). Wafer surfaces, mechanically finished by several kinds of wheel grinding,were studied using cross-sectional TEM observation. Discrete Fourier Transformation (DFT) profile of the surface brings more information than the conventional surfaceprofile measurements. Measuring the damage regions by the several grinding conditions are also studying.
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