Proj
J-GLOBAL ID:200904050817882680  Research Project code:9800036996 Update date:Jan. 24, 2003

Roughness of the ground silicon wafers and the damage region near the surface

研削のシリコンウェーハの表面粗さとダメージ領域
Study period:1995 - 2000
Organization (1):
Investigating Researcher (1):
Research overview:
The total thickness variation value (TTV) of the silicon wafers play a important roll in the fabrication of large scale integrated circuits (LSI). Wafer surfaces, mechanically finished by several kinds of wheel grinding,were studied using cross-sectional TEM observation. Discrete Fourier Transformation (DFT) profile of the surface brings more information than the conventional surfaceprofile measurements. Measuring the damage regions by the several grinding conditions are also studying.
Keywords (7):
silicon ,  wafer(IC) ,  grinding ,  surface ,  transmission ,  electron ,  damage
Research program: Ordinary Research
Research budget: 1996: \2,500,000

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