Proj
J-GLOBAL ID:200904060070195234  Research Project code:9800017358 Update date:Dec. 11, 1996

Micro bonding in packaging process of electronic parts

電子部品実装工程におけるマイクロ接合
Study period:1992 - 1995
Organization (1):
Investigating Researcher (4):
Keywords (7):
printed ,  high ,  heat ,  YAG ,  soldering ,  electronic ,  metal
Research program: Ordinary Research
Research budget: 1995: \0

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