Proj
J-GLOBAL ID:200904062742701217  Research Project code:9800036782 Update date:Mar. 23, 1998

Development of pressure sensitive adhesive by electron beam curing and investigation of their surface ultrastructure

放射線によるシール・ラベルの高品質化と表面解析技術の開発
Study period:1996 - 1999
Organization (1):
Investigating Researcher (4):
Research overview:
Development of pressure-sensitive adhesive labels by ED curing and analysis of their surface structure by TEM, SEM and AFM are planned.
Keywords (9):
label ,  adhesive ,  electron ,  chemical ,  electron ,  microscopy ,  scanning ,  structure ,  surface
Research program: Ordinary Research
Research budget: 1997: \36,765,000

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