Proj
J-GLOBAL ID:200904068990329748  Research Project code:0250005401 Update date:Jun. 13, 2008

Development of highly heat-conducting substrate of next generation

次世代型高熱伝導基板の開発
Study period:2001 - 2001
Organization (1):
Investigating Researcher (4):
Research field (1): Other
Research overview:
Heat generation from circuits has come to be a serious problem accompanying improvement in function, increased density, and increased output, which has been demanding circuit substrate superior in heat discharging characteristics. Study thus develops highly heat conducting substrate with minimal thermal resistance by formation of ceramic film on carbonaceous material to provide it with electric insulation, on which a circuit is directly provided.
Research program: -

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