Research Project code：0150003101
Update date：Nov. 26, 2001
Study on the adhesion properties of non-electrophoretic plating films on ceramics for electronic material. The initial precipitation of plate on ceramics and evaluation of the adhesion properties
1995 - 2000
Investigating Researcher (3)：
Various ceramics materials (e.g. dielectric ceramics which is a main part of cellular phone) are developed for use in minute electronic parts including mobile communication tools. In order to use them as electronic parts, it is necessary to form metallic layer tightly adhered to the surface. Non-electrophoretic plating method is superior in productivity and cost reduction but the adhesion strength is weaker than the generally used silver paste sintering method. The excess etching is not good for electronic properties of ceramic surface. The purpose of the study is to obtain the method to improve adhesion properties of plating film in small domains suppressing the etching of the ceramic material to the minimum. During the study of the Heisei 7-9th that has been performed on the factors of adhesion properties of plating films using alumina substrate, adhesion increased in certain conditions. In Heisei 10th the evaluation method of the state of precipitation of Pb catalyst by QCM method was investigated as a basic study for elucidating the mechanism of adhesion improvement, and in Heisei 11th the evaluation of the initial precipitation of Ni-P plate on metal electrode is carried out. In Heisei 12th the initial precipitation on the ceramics is evaluated and correlation with adhesion strength is investigated.
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