high density packaging

電気工学
Related terms (5)：

micro circuit technique (超小形回路技術)
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interposer (インターポーザ)
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on chip (オンチップ)
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high integration (高集積化)
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inter-track interference (トラック間干渉)
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Broader terms (1)：

packaging (mounting) (実装)
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Narrower terms (4)：

multichip packaging (マルチチップ実装)
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surface mount technology (表面実装)
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chip on board (チップオンボード)
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three-dimensional packaging (三次元実装)
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