Mat
J-GLOBAL ID：200909017142221796
JST material number (FULL)：W0624AAY
JST material number：W0624A
ASME. EEP (American Society of Mechanical Engineers. Electrical and Electronic Packaging Div.)
JST material number：
JST material number
Identifier of Material (journals)
W0624A
Material type：Article, Print, 2a
Publication frequency： 2a
Country of issued：United States(USA)
Language (1)：
English(EN)
JST classification (1)：
産業機械 (QE)
Publisher：
American Society of Mechanical Engineers
Publication place：New York
Conference name (27)：
- ASME International Mechanical Engineering Congress and Exposition, Orlando, Fla., 20001105 - 20001110
- Workshop on Mechanical Reliability of Polymeric Materials and Plastic Packages of IC Devices, Paris, 19981129 - 19981202
- Workshop on Polymeric Materials for Microelectronics and Photonics Applications: Mechanics, Physics, Reliability, Processing, Paris, 19991212 - 19991215
- ASME International Mechanical Engineering Congress and Exposition, Anaheim, Calif., 19981115 - 19981120
- ASME International Mechanical Engineering Congress and Exposition, Dallas, Tex., 19971116 - 19971121
ｍore...
Successor material name (1)：
- ASME. EPP (American Society of Mechanical Engineers. Electronic and Photonic Packaging Div.)
JST library information (0)
※：
※Subject to change. Contact us for the latest status.
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