Mat
J-GLOBAL ID：200909021305825322
JST material number (FULL)：K20000521G
JST material number：K20000521
2000 Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Vol.2
JST material number：
JST material number
Identifier of Material (journals)
K20000521
ISBN (1)：
0-7803-5913-5
Material type：Proceedings, Print, zz
Publication frequency： zz
Country of issued：United States(USA)
Language (1)：
English(EN)
JST classification (2)：
電子工学 (NC)
, 計算機方式・ハードウェア (JC)
Editor/ Editing house (4)：
Institute of Electrical and Electronics Engineers. Components, Packaging, and Manufacturing Technology Society
, American Society of Mechanical Engineers. Heat Transfer in Electronic Equipment Committee
, United States. National Inst. of Standards and Technology
, International Microelectronics and Packaging Society
Publisher：
Institute of Electrical and Electronics Engineers
Publication place：Piscataway, N.J.
Conference name (2)：
- Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, 7th, Las Vegas, Nev., 20000523 - 20000526
- ITherm 2000
JST library information (0)
※：
※Subject to change. Contact us for the latest status.
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