Mat
J-GLOBAL ID:200909023719051291   JST material number (FULL):K20000520J   JST material number:K20000520

2000 Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Vol.1

JST material number:
JST material number
Identifier of Material (journals)
K20000520
ISSN (1): 1089-9870
ISBN (1): 0-7803-5913-5
Material type:Proceedings, Print, zz
Publication frequency: zz
Country of issued:United States(USA)
Language (1): English(EN)
JST classification  (2): 電子工学 (NC) ,  計算機方式・ハードウェア (JC)
Editor/ Editing house (4): Institute of Electrical and Electronics Engineers. Components, Packaging, and Manufacturing Technology Society ,  American Society of Mechanical Engineers. Heat Transfer in Electronic Equipment Committee ,  United States. National Inst. of Standards and Technology ,  International Microelectronics and Packaging Society
Publisher: Institute of Electrical and Electronics Engineers
Publication place:Piscataway, N.J.
Conference name  (2):
  • Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, 7th, Las Vegas, Nev., 20000523 - 20000526
  • ITherm 2000
JST library information (0)

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