Mat
J-GLOBAL ID：200909045419393941
JST material number (FULL)：K20010023C
JST material number：K20010023
Benfiting from Thermal and Mechanical Simulation in Micro-Electronics
JST material number：
JST material number
Identifier of Material (journals)
K20010023
ISBN (1)：
0-7923-7278-6
Material type：Proceedings, Print, zz
Publication frequency： zz
Country of issued：Netherlands(NLD)
Language (1)：
English(EN)
JST classification (1)：
電子工学 (NC)
Editor/ Editing house (2)：
Co-ordination of Microelectronics Packaging & Interconnection Projects: Environment and Trends for the Development of European Solutions
, European Union
Publisher：
Kluwer Academic Publ.
Publication place：Dordrecht
Conference name (2)：
- International Conference Specially Dedicated to Mechanical and Thermal Simulations in (Micro)-Electronics, 1st, Eindhoven, 20000323 - 20000324
- SIME 2000
JST library information (0)
※：
※Subject to change. Contact us for the latest status.
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