J-GLOBAL ID:200909045419393941   JST material number (FULL):K20010023C   JST material number:K20010023

Benfiting from Thermal and Mechanical Simulation in Micro-Electronics

JST material number:
JST material number
Identifier of Material (journals)
ISBN (1): 0-7923-7278-6
Material type:Proceedings, Print, zz
Publication frequency: zz
Country of issued:Netherlands(NLD)
Language (1): English(EN)
JST classification  (1): 電子工学 (NC)
Editor/ Editing house (2): Co-ordination of Microelectronics Packaging & Interconnection Projects: Environment and Trends for the Development of European Solutions ,  European Union
Publisher: Kluwer Academic Publ.
Publication place:Dordrecht
Conference name  (2):
  • International Conference Specially Dedicated to Mechanical and Thermal Simulations in (Micro)-Electronics, 1st, Eindhoven, 20000323 - 20000324
  • SIME 2000
JST library information (0)

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