Mat
J-GLOBAL ID：200909077969536188
JST material number (FULL)：H0255CBG
JST material number：H0255C
IEEE Transactions on Components and Packaging Technologies
JST material number：
JST material number
Identifier of Material (journals)
H0255C
ISSN (1)：
1521-3331
CODEN (1)：
ITCPFB
Material type：Article, Print, q
Publication frequency： q
Country of issued：United States(USA)
Language (1)：
English(EN)
JST classification (2)：
電子工学 (NC)
, 電気工学一般 (NA)
Editor/ Editing house (1)：
IEEE Components, Packaging, and Manufacturing Technology Society
Publisher：
Institute of Electrical and Electronics Engineers
, Institute of Electrical and Electronics Engineers. Components, Packaging, and Manufacturing Technology Society
Publication place：New York
Previous material name (1)：
- IEEE Transactions on Components, Packaging, and Manufacturing Technology - Part A
Successor material name (1)：
- IEEE Transactions on Components, Packaging, and Manufacturing Technology
JST library information (0)：
Subject to change. Contact us for the latest status.
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