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J-GLOBAL ID：201002023481282457   Reference number：78A0226988

The structure and properties of reactively bonded thick film gold conductors.

化学反応的に接着した金厚膜導体の構造と特性
Author (2)：
COLEMAN M V

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, 
GURNETT G E

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Material：
Electrocomponent Sci Technol  (Electrocomponent Science and Technology)

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Volume： 5  Issue： 1  Page： 55-59  Publication year： 1978 
JST Material Number： C0101C  ISSN： 0305-3091  Document type： Article
Article type： 原著論文  Country of issue： United Kingdom (GBR)  Language： ENGLISH (EN)
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厚膜技術

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化学反応

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金

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厚膜

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, 
導体

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