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J-GLOBAL ID:201002249450726851   Reference number:10A0338663

A Fundamental Study of Wet Blast Processing (Solid Particle Size Effects on Processing Mechanism of Monocrytalline Silicon Wafer)

ウェットブラスト加工に関する基礎的研究(投射固体粒子径の単結晶Siウェハの加工メカニズムへの影響)
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Material:
Volume: 76  Issue: 763  Page: 741-748  Publication year: Mar. 25, 2010 
JST Material Number: F0045B  ISSN: 0387-5024  Document type: Article
Article type: 原著論文  Country of issue: Japan (JPN)  Language: JAPANESE (JA)
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Manufacturing technology of solid-state devices 

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