Art

J-GLOBAL ID：201002294967663421   Reference number：10A0843513

Study on Peeling Behavior in Pick-up Process of IC Chip with Adhesive Tapes

接着テープによるICチップのピックアップ過程における剥離挙動に関する研究

Author (5)： SAIKI Naoya (Dep. of Mechanical Sciences and Engineering, Tokyo Inst. of Technol.) ,  INABA Kazuaki (Dep. of Mechanical Sciences and Engineering, Tokyo Inst. of Technol.) ,  KISHIMOTO Kikuo (Dep. of Mechanical Sciences and Engineering, Tokyo Inst. of Technol.) ,  SENO Hideo (LINTEC Corp.) ,  EBE Kazuyoshi (LINTEC Corp.)
Material： Journal of Solid Mechanics and Materials Engineering (Web)  (J Solid Mech Mater Eng (Web))
Volume： 4  Issue： 7  Page： 1051-1060 (J-STAGE)  Publication year： 2010 
JST Material Number： U0026A  ISSN： 1880-9871  Document type： Article
Article type： 原著論文  Country of issue： Japan (JPN)  Language： ENGLISH (EN)

Thesaurus term： adhesive tape ,  *semiconductor chip ,  *exfoliation ,  finite element method ,  peeling test ,  Finite Element Analysis
Semi thesaurus term： *IC chip ,  FEM analysis

JST classification (1)： Manufacturing technology of solid-state devices  (NC03030V)

Reference (14)：

• (1) Kim, H. S. and Song. H. G, Investigation of Moisture-induced Failures of Stacked-die Package, Microelectronics Reliability, Vol.47 (2007), pp. 1673-1679.
• (2) Ebe, K., Seno, H. and Yamazaki, O., Pressure Sensitive and Bonding Adhesives for Packaging Stacked Integrated Circuits I. Investigation on the UV/Thermally Dual-Curable Formulations., Journal of the Adhesion Society of Japan, Vol. 40, No. 7 (2004), pp. 289-297.
• (3) Ebe, K., Seno, H., Sugino, T. and Yamazaki, O., Pressure Sensitive and Bonding Adhesives for Packaging Stacked Integrated Circuits II. Effects of UV Curing of the Multi-functional Acrylate Component on the Bonding Strength to Copper Plate., Journal of the Adhesion Society of Japan, Vol. 41, No. 4 (2005), pp. 128-136.
• (4) Kim, K. S. and Aravas, N., Elastoplastic Analysis of the Peel Test, International Journal of Solids and Structure, Vol. 24, No. 4 (1988), pp. 417-435.
• (5) Omiya, M., Inoue, H. and Kishimoto, K., Evaluation of Interfacial Strength by Multi-stages Peel Test, Key Engineering Materials, Vol. 261-263 (2004), pp. 483.

Terms in the title (6)： 接着テープ ,  ICチップ ,  ピックアップ ,  過程 ,  挙動 ,  研究