Effects of grain size on fatigue crack propagation in copper film

SHIMIZU K.; TORII T.

Art

J-GLOBAL ID：201102219017706065 Reference number：11A0170477

Effects of grain size on fatigue crack propagation in copper film

銅箔の疲労亀裂伝搬に及ぼす結晶粒度の効果

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Author (2)： ,
Material：
Volume： 452/453 Page： 289-292 Publication year： 2011
JST Material Number： D0744C ISSN： 1013-9826 Document type： Article
Article type：原著論文 Country of issue： Switzerland (CHE) Language： ENGLISH (EN)

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Metallic materials

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