Art

J-GLOBAL ID：201102232906047860   Reference number：11A1427975

New Grinding Technique to Simplify the Recycling Process of Scrap Electronic Devices

廃電子デバイスのリサイクル工程を簡素化する新しい粉砕技術

Author (3)： KOYANAKA Shigeki (National Inst. advanced Industrial Sci. and Technol. (AIST), Ibaraki, JPN) ,  OHYA Hitoshi (National Inst. advanced Industrial Sci. and Technol. (AIST), Ibaraki, JPN) ,  ENDOH Shigehisa (National Inst. advanced Industrial Sci. and Technol. (AIST), Ibaraki, JPN)
Material： Review of Automotive Engineering  (Rev Automot Eng)
Volume： 27  Issue： 2  Page： 353-355  Publication year： Apr. 2006 
JST Material Number： Z0829A  ISSN： 1349-4724  Document type： Article
Article type： 原著論文  Country of issue： Japan (JPN)  Language： ENGLISH (EN)

Thesaurus term： *printed board ,  *recycling ,  *grinding and milling ,  *separation and selection ,  crusher and mill ,  electronic circuit ,  screen (separator) ,  exfoliation ,  metal foil ,  phenolic resin ,  fiber reinforced plastic ,  recycled resource ,  recycling process ,  electron device ,  *utilization ,  *reuse
Semi thesaurus term： electron device

JST classification (4)： Recycling of resources  (SC05060V) ,  Solic-state devices in general  (NC03010Z) ,  Printed circuits  (NA05040O) ,  Electric equipment  (QG03070C)

Reference (3)：

• KOYANAKA, S. Particle shape of copper milled by swing-hammer-type impact mill. Powder Technology. 1997, 90, 135-140
• GENTE, V. Cryo-comminution of plastic waste. Waste Management. 2004, 24, 663-672
• ROWSON, N. A. Thermally-assisted liberation for reclamation of copper from copper-plastic scrap. Recycling of Metalliferous Materials, Birmingham, England, 1990. 1990

Terms in the title (4)： 電子デバイス ,  リサイクル工程 ,  簡素化 ,  粉砕