Art
J-GLOBAL ID:201102287489374681   Reference number:11A1100732

Packaging and Assembly for Integrated Photonics-A Review of the ePIXpack Photonics Packaging Platform

集積フォトニクス用のパッケージングと集合 - ePIXpackフォトニクスパッケージングプラットフォームの解説
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Volume: 17  Issue:Page: 645-651  Publication year: May. 2011 
JST Material Number: W0734A  ISSN: 1077-260X  CODEN: IJSQEN  Document type: Article
Article type: 原著論文  Country of issue: United States (USA)  Language: ENGLISH (EN)
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Hydrid integrated circuit 
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