Rsrc
J-GLOBAL ID:201110042468665919   Research Resource code:5000004344 Update date:Jan. 24, 2006

Sputtering apparatus

スパッタリング蒸着装置
Owning Organization:
Contact: KUSABIRAKI Kiyoshi
Resource classification: Experience equipment, Facilities, etc
Research area  (4): Inorganic chemistry ,  Applied physical properties/crystal engineering ,  Electronic device/electronic equipment ,  Metallic physical properties
Overview:
This apparatus is used to deposit thin films of high
melting point materials by sputtering action of argon
ions. Sputtering turgets used in this apparatus are
oxides and nitrides of metals, alloys, etc..
User procedures and method:
[Procedure for Use] Make inquiries with a clerk in
charge.
[Qualification] Cooperative researchers with
researchers in Toyama University.

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