Rsrc
J-GLOBAL ID:201110066566308160   Research Resource code:5000002539 Update date:Dec. 15, 2003

Diffusion Bonding Equipment

拡散接合装置
Owning Organization:
Contact: OHASHI Osamu
Resource classification: Others
Research area  (1): Material processing/treatment
Overview:
Bonding equipment to bond various materials with
heating and loading divices. Vacuum: 10-5Pa
Max Temperature: 1200°C, Max Load: 200kg
User environment and conditions:
We are not wanted to disturb our duties using the equipment.
User procedures and method:
Please contact to Prof. O. OHASHI

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