Rsrc
J-GLOBAL ID：201110066566308160
Research Resource code：5000002539
Update date：Dec. 15, 2003
Diffusion Bonding Equipment
拡散接合装置
Owning Organization：
Contact：
OHASHI Osamu
Resource classification：
Others
Research area (1)：
Material processing/treatment
Overview：
Bonding equipment to bond various materials with
heating and loading divices. Vacuum: 10-5Pa
Max Temperature: 1200°C, Max Load: 200kg
User environment and conditions：
We are not wanted to disturb our duties using the equipment.
User procedures and method：
Please contact to Prof. O. OHASHI
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